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Microchip Fabrication A Practical Guide to Semiconductor Processing 6th Edition by Peter Van Zant 0071821015 978-0071821018
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ISBN 10: 0071821015
ISBN 13: 978-0071821018
Author: Peter Van Zant
Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition
A Practical Guide to Semiconductor Processing
The most complete, current guide to semiconductor processing Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors. State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry. COVERAGE INCLUDES: The semiconductor industry Properties of semiconductor materials and chemicals Crystal growth and silicon wafer preparation Wafer fabrication and packaging Contamination control Productivity and process yields Oxidation The ten-step patterning process–surface preparation to exposure; developing to final inspection Next generation lithography Doping Layer deposition Metallization Process and device evaluation The business of wafer fabrication Devices and integrated circuit formation Integrated circuits Packaging
Microchip Fabrication A Practical Guide to Semiconductor Processing 6th Table of contents:
Chapter 1: The Semiconductor Industry
- Birth and evolution of the semiconductor industry.
- Key concepts like Moore’s Law, decreasing feature size, and increasing wafer size.
- Trends in chip costs and manufacturing stages.
- Transition to the Nano Era and its implications.
Chapter 2: Properties of Semiconductor Materials and Chemicals
- Atomic structure and electrical conduction principles.
- Characteristics of intrinsic and doped semiconductors.
- Overview of semiconductor production materials like silicon, germanium, and compounds.
- Safety and chemical purity considerations.
Chapter 3: Crystal Growth and Silicon Wafer Preparation
- Detailed steps in silicon wafer preparation, from crystal growth to final polishing.
- Techniques like the Czochralski method and float zone process.
- Evaluation and packaging of wafers for various applications.
Chapter 4: Overview of Wafer Fabrication and Packaging
- Fundamentals of wafer fabrication, including layering, patterning, doping, and heat treatments.
- Overview of chip and wafer terminology.
- Introduction to wafer sort and packaging processes.
Chapter 5: Contamination Control
- Challenges and strategies for maintaining cleanroom environments.
- Sources of contamination and methods for wafer cleaning.
- Techniques for contamination detection and removal.
Chapter 6: Productivity and Process Yields
- Factors affecting process yields, including wafer defects, feature size, and defect density.
- Yield measurement formulas and strategies for improvement.
- Importance of process cycle time and overall productivity.
Chapter 7: Oxidation
- Role of silicon dioxide layers in devices (e.g., surface passivation and MOS gates).
- Methods of thermal oxidation and post-oxidation evaluation.
- Advanced techniques like rapid thermal processing and high-pressure oxidation.
Chapter 8: The Ten-Step Patterning Process—Surface Preparation to Exposure
- Overview of photomasking and photoresist chemistry.
- Step-by-step guide to surface preparation, photoresist application, and exposure processes.
- Comparison of positive and negative photoresists.
Chapter 9: The Ten-Step Patterning Process—Developing to Final Inspection
- Processes like resist development, wet/dry etching, and resist stripping.
- Techniques for final inspection and defect detection.
- Key etching challenges such as selectivity and profile control.
Chapter 10: Next Generation Lithography
- Challenges in scaling lithography for advanced nodes.
- Techniques like extreme ultraviolet (EUV) and X-ray lithography.
- Innovations in resist technology and advanced planarization methods.
Chapter 11: Doping
- Overview of doping methods like diffusion and ion implantation.
- Formation of N-P junctions and dopant concentration analysis.
- Future trends in doping and annealing technologies.
Chapter 12: Layer Deposition
- Techniques for depositing thin films, including CVD, ALD, and PVD.
- Applications for insulating, conducting, and semiconducting layers.
- Advances in deposition for high-k and low-k materials.
Chapter 13: Metallization
- Methods for depositing conductive materials like aluminum and copper.
- Dual-damascene processes and the role of CMP.
- Metallization for MOS gates, interconnects, and advanced packaging.
Chapter 14: Process and Device Evaluation
- Methods for electrical, physical, and contamination measurements.
- Tools like four-point probes, ellipsometers, and scanning electron microscopes.
- Defect detection and device failure analysis techniques.
Chapter 15: The Business of Wafer Fabrication
- Economics of semiconductor manufacturing, including cost factors and automation.
- Yield improvement and statistical process control.
- Trends in green fabs and just-in-time inventory systems.
Chapter 16: Introduction to Devices and Integrated Circuit Formation
- Basics of semiconductor devices like resistors, diodes, and transistors.
- Formation of integrated circuits, including MOS and Bi-MOS technologies.
- Overview of MEMS, LEDs, and optoelectronics applications.
Chapter 17: Introduction to Integrated Circuits
- Fundamentals of circuit design and types of integrated circuits.
- Logic and memory circuit operations.
- Future trends and redundancy techniques in IC design.
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