Physical design for 3D integrated circuits 1st edition by Aida Todri Sanial, Chuan Seng Tan, Krzysztof Iniewski ISBN 0367778874 978-0367778873

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Product details: 

ISBN 10: 0367778874

ISBN 13: 978-0367778873

Author: Aida Todri Sanial, Chuan Seng Tan, Krzysztof Iniewski

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.

The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference:

• Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs
• Supplies state-of-the-art solutions for challenges unique to 3D circuit design
• Features contributions from renowned experts in their respective fields

Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

Physical design for 3D integrated circuits 1st Table of contents: 

Part 1: Fundamentals of 3D Integration

• Chapter 1: Introduction to 3D Integrated Circuits
  • Motivation for 3D Integration
  • Benefits and Challenges of 3D ICs
  • 3D IC Technologies (Through-Silicon Vias (TSVs), 2.5D Integration)
  • Applications of 3D ICs (High-Performance Computing, Mobile Devices, AI/ML)
• Chapter 2: 3D IC Design Flow
  • Design Methodology for 3D ICs
  • 3D Design Tools and EDA Software
  • Design for Manufacturability (DFM) Considerations

Part 2: Key Challenges and Solutions

• Chapter 3: Thermal Management
  • Heat Generation and Dissipation in 3D ICs
  • Thermal Modeling and Simulation
  • Cooling Techniques (Heat Spreaders, Microchannels)
• Chapter 4: Power Delivery and Distribution
  • Power Delivery Networks (PDNs) in 3D ICs
  • IR Drop and Electromigration
  • Power Supply Noise and Solutions
• Chapter 5: Signal Integrity and Interconnect
  • Through-Silicon Vias (TSVs) and Interconnect Design
  • Signal Propagation and Delay
  • Crosstalk and Noise Issues
• Chapter 6: Reliability
  • Reliability Challenges in 3D ICs (Stress, Wear-out, Failure Mechanisms)
  • Reliability Assessment and Testing
  • Design for Reliability Techniques

Part 3: Advanced Topics

• Chapter 7: 3D IC Design for Specific Applications
  • High-Performance Computing (HPC)
  • Mobile and Wearable Devices
  • AI/Machine Learning Accelerators
  • Memory-Centric Architectures
• Chapter 8: Emerging Technologies
  • Advanced Packaging Technologies
  • Heterogeneous Integration
  • Photonics Integration

Part 4: Future Trends and Challenges

• Chapter 9: Future Directions in 3D IC Design
  • Emerging Materials and Devices
  • Design Automation and AI in 3D IC Design
  • Challenges and Opportunities in 3D IC Technology

Appendices

• Appendix A: Key Equations and Formulas
• Appendix B: Glossary of Terms
• Appendix C: 3D IC Design Tools and Software
• Appendix D: Further Reading and Resources

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Aida Todri Sanial,Chuan Seng Tan,Krzysztof Iniewski,Physical design,3D integrated