Systems Level Packaging for Millimeter Wave Transceivers 1st edition by Mladen Božanić, Saurabh Sinha – Ebook PDF Instant Download/Delivery: 3030146900, 9783030146900
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Product details:
ISBN 10: 3030146900
ISBN 13: 9783030146900
Author: Mladen Božanić, Saurabh Sinha
This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
Systems Level Packaging for Millimeter Wave Transceivers 1st Table of contents:
1. Research Impact of System-Level Packaging for Millimeter-Wave Transceivers
2. Millimeter-Wave Research Challenges
3. Behavior of Active and Passive Devices at Millimeter-Wave Frequencies
4. Integrated Substrates: Millimeter-Wave Transistor Technologies
5. Discrete Substrates: Package Foundation
6. Traditional Approach: System-on-Chip
7. Multi-chip Modules and Multi-chip Packaging
8. State-of-the-Art Approach: System-on-Package
9. Assessment of Completed Work and Future Directions in Millimeter-Wave Research
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Tags: Mladen Božanić, Saurabh Sinha, Systems Level, Wave Transceivers